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"Integrated Personalized Thermal Comfort Model for Input Variable Reduction."

Chuangkang Yang et al. (2023)

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DOI: 10.1145/3600100.3626256

access: closed

type: Conference or Workshop Paper

metadata version: 2023-11-09

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  dblp key:
  - conf/sensys/YangTMA23
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  - https://dblp.org/rec/conf/sensys/YangTMA23
Chuangkang Yang, Keiichiro Taniguchi, Shohei Miyata, Yasunori Akashi:
Integrated Personalized Thermal Comfort Model for Input Variable Reduction. BuildSys@SenSys 2023: 271-273

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