"Damage mechanics modeling of concurrent thermal and vibration loading on ..."

Cemal Basaran et al. (2007)

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DOI: —

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-28

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  dblp key:
  - conf/scsc/BasaranGLL07
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  - https://dblp.org/rec/conf/scsc/BasaranGLL07
Cemal Basaran, Juan Gomez, Minghui Lin, Shidong Li:
Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging. SCSC 2007: 269-275

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