"A system-on-package module by embedding a mobile TV IC in ..."

Jong In Ryu et al. (2012)

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DOI: 10.1109/RWS.2012.6175313

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-24

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Jong In Ryu, Se-Hoon Park, Dongsu Kim, Jun Chul Kim, Hyeongdong Kim, Jong Chul Park:
A system-on-package module by embedding a mobile TV IC in printed-circuit-board. RWS 2012: 283-286

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