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"A hot embossing robot for bonding microfluidic chips: design, control and ..."
Dongxu Zhang et al. (2019)
- Dongxu Zhang, Zhenyu Weng, Ya Zhang, Haozheng Dai, Jiageng Wu, Xiaoping Min, Shengxiang Ge:
A hot embossing robot for bonding microfluidic chips: design, control and test. RCAR 2019: 679-684
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