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"Oscillation ring testing methodology of TSVs in 3D stacked ICs."

Shadi M. Harb, William R. Eisenstadt (2016)

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DOI: 10.1109/NORCHIP.2016.7792911

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  dblp key:
  - conf/norchip/HarbE16
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Shadi M. Harb, William R. Eisenstadt:
Oscillation ring testing methodology of TSVs in 3D stacked ICs. NORCAS 2016: 1-4

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