Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging."

Yichao Xu et al. (2013)

> Home

Details and statistics

DOI: 10.1109/NEMS.2013.6559722

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/nems/XuW0FMJ13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/nems/XuW0FMJ13
Yichao Xu, Guanjiang Wang, Xin Sun, Runiu Fang, Min Miao, Yufeng Jin:
In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging. NEMS 2013: 233-236

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.