"Research on deep RIE-based through-Si-via micromachining for 3-D ..."

Min Miao et al. (2009)

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DOI: 10.1109/NEMS.2009.5068533

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

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  - conf/nems/MiaoJLZZSG09
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  - https://dblp.org/rec/conf/nems/MiaoJLZZSG09
Min Miao, Yufeng Jin, Hongguang Liao, Liwei Zhao, Yunhui Zhu, Xin Sun, Yunxia Guo:
Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration. NEMS 2009: 90-93

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