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"Backside nanotexturing protected by thin silicon layer for high bending ..."

Chia-Liang Hsu et al. (2016)

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DOI: 10.1109/NEMS.2016.7758316

access: closed

type: Conference or Workshop Paper

metadata version: 2021-08-05

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  - conf/nems/HsuKKYH16
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Chia-Liang Hsu, Kunal Kashyap, Amarendra Kumar, J. Andrew Yeh, Max T. Hou:
Backside nanotexturing protected by thin silicon layer for high bending strength ICs. NEMS 2016: 569-572

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