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"Fabrication and characterization of fine pitch TSV integration with ..."

Yong Guan et al. (2016)

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DOI: 10.1109/NEMS.2016.7758207

access: closed

type: Conference or Workshop Paper

metadata version: 2021-08-05

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  dblp key:
  - conf/nems/GuanZCMJ16
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Yong Guan, Qinghua Zeng, Jing Chen, Shenglin Ma, Yufeng Jin:
Fabrication and characterization of fine pitch TSV integration with self-aligned backside insulation layer opening. NEMS 2016: 91-94

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