"Wafer-level vacuum packaging for hetero-integration by thermo-compression ..."

Muhammad Salman Al Farisi, Hideki Hirano, Shuji Tanaka (2016)

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DOI: 10.1109/NEMS.2016.7758317

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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Muhammad Salman Al Farisi, Hideki Hirano, Shuji Tanaka:
Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps. NEMS 2016: 573-577

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