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"SPICE Modeling and CMOS Circuit Development of a SiC Power IC Technology."

Tianshi Liu et al. (2021)

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DOI: 10.1109/MWSCAS47672.2021.9531903

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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  - https://dblp.org/rec/conf/mwscas/LiuZIAMLSWFA21
Tianshi Liu, Hua Zhang, Sundar Babu Isukapati, Emaran Ashik, Adam J. Morgan, Bongmook Lee, Woongje Sung, Marvin H. White, Ayman A. Fayed, Anant K. Agarwal:
SPICE Modeling and CMOS Circuit Development of a SiC Power IC Technology. MWSCAS 2021: 966-969

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