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"Reflow Oven for Heating and Soldering SMD and BGA Components."

Pawel Pawlowski et al. (2018)

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DOI: 10.23919/MIXDES.2018.8436841

access: closed

type: Conference or Workshop Paper

metadata version: 2021-04-09

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  dblp key:
  - conf/mixdes/PawlowskiDGB18
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  - https://dblp.org/rec/conf/mixdes/PawlowskiDGB18
Pawel Pawlowski, Adam Dabrowski, Marcin Grenz, Michal Bladowski:
Reflow Oven for Heating and Soldering SMD and BGA Components. MIXDES 2018: 324-329

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