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"Prospects for Wafer-Level Testing of Gigascale Chips with Electrical and ..."

Hiren D. Thacker, James D. Meindl (2006)

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DOI: 10.1109/TEST.2006.297668

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-24

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Hiren D. Thacker, James D. Meindl:
Prospects for Wafer-Level Testing of Gigascale Chips with Electrical and Optical I/O Interconnects. ITC 2006: 1-7

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