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"A N: 1 Single-Channel TDMA Fault-Tolerant Technique for TSVs in 3D-ICs."

Huaguo Liang et al. (2021)

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DOI: 10.1109/ITC-ASIA53059.2021.9808672

access: closed

type: Conference or Workshop Paper

metadata version: 2022-07-15

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  dblp key:
  - conf/itc-asia/LiangLYNHJ21
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  - https://dblp.org/rec/conf/itc-asia/LiangLYNHJ21
Huaguo Liang, Danqing Li, Zhao Yang, Tianming Ni, Zhengfeng Huang, Cuiyun Jiang:
A N: 1 Single-Channel TDMA Fault-Tolerant Technique for TSVs in 3D-ICs. ITC-Asia 2021: 1-5

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