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"Cost and Thermal Analysis of High-Performance 2.5D and 3D Integrated ..."
Dylan C. Stow et al. (2016)
- Dylan C. Stow, Itir Akgun, Russell Barnes, Peng Gu, Yuan Xie:
Cost and Thermal Analysis of High-Performance 2.5D and 3D Integrated Circuit Design Space. ISVLSI 2016: 637-642
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