"Improving FPGA Design with Monolithic 3D Integration Using High Dense ..."

Srivatsa Rangachar Srinivasa et al. (2017)

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DOI: 10.1109/ISVLSI.2017.31

access: closed

type: Conference or Workshop Paper

metadata version: 2025-06-17

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Srivatsa Rangachar Srinivasa, Karthik Mohan, Wei-Hao Chen, Kuo-Hsinag Hsu, Xueqing Li, Meng-Fan Chang, Sumeet Kumar Gupta, John Sampson, Vijaykrishnan Narayanan:
Improving FPGA Design with Monolithic 3D Integration Using High Dense Inter-Stack Via. ISVLSI 2017: 128-133

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