"11.2 A 3D integrated Prototype System-on-Chip for Augmented Reality ..."

Tony F. Wu et al. (2024)

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DOI: 10.1109/ISSCC49657.2024.10454529

access: closed

type: Conference or Workshop Paper

metadata version: 2024-04-01

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Tony F. Wu, Huichu Liu, Huseyin Ekin Sumbul, Lita Yang, Dipti Baheti, Jeremy Coriell, William Koven, Anu Krishnan, Mohit Mittal, Matheus Trevisan Moreira, Max Waugaman, Laurent Ye, Edith Beigné:
11.2 A 3D integrated Prototype System-on-Chip for Augmented Reality Applications Using Face-to-Face Wafer Bonded 7nm Logic at <2μm Pitch with up to 40% Energy Reduction at Iso-Area Footprint. ISSCC 2024: 210-212

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