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"184QPS/W 64Mb/mm23D Logic-to-DRAM Hybrid Bonding with ..."

Dimin Niu et al. (2022)

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DOI: 10.1109/ISSCC42614.2022.9731694

access: closed

type: Conference or Workshop Paper

metadata version: 2022-06-21

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  dblp key:
  - conf/isscc/NiuLWHZGGSXDFZJ22
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Dimin Niu, Shuangchen Li, Yuhao Wang, Wei Han, Zhe Zhang, Yijin Guan, Tianchan Guan, Fei Sun, Fei Xue, Lide Duan, Yuanwei Fang, Hongzhong Zheng, Xiping Jiang, Song Wang, Fengguo Zuo, Yubing Wang, Bing Yu, Qiwei Ren, Yuan Xie:
184QPS/W 64Mb/mm²3D Logic-to-DRAM Hybrid Bonding with Process-Near-Memory Engine for Recommendation System. ISSCC 2022: 1-3

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