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"6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 ..."

Christophe Erdmann et al. (2014)

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DOI: 10.1109/ISSCC.2014.6757364

access: closed

type: Conference or Workshop Paper

metadata version: 2020-08-10

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  - conf/isscc/ErdmannLLKMCBKL14
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Christophe Erdmann, Donnacha Lowney, Adrian Lynam, Aidan Keady, John McGrath, Edward Cullen, Daire Breathnach, Denis Keane, Patrick Lynch, Marites De La Torre, Ronnie De La Torre, Peng Lim, Anthony Collins, Brendan Farley, Liam Madden:
6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters. ISSCC 2014: 120-121

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