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"Thermal Modeling and Design Exploration for Monolithic 3D ICs."

Baoli Peng et al. (2022)

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DOI: 10.1109/ISQED54688.2022.9806142

access: closed

type: Conference or Workshop Paper

metadata version: 2022-07-04

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  dblp key:
  - conf/isqed/PengPCC22
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  persistent URL:
  - https://dblp.org/rec/conf/isqed/PengPCC22
Baoli Peng, Vasilis F. Pavlidis, Yi-Chung Chen, Yuanqing Cheng:
Thermal Modeling and Design Exploration for Monolithic 3D ICs. ISQED 2022: 1-6

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