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"Thermal via structural design in three-dimensional integrated circuits."

Leslie Hwang, Kevin L. Lin, Martin D. F. Wong (2012)

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DOI: 10.1109/ISQED.2012.6187481

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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  - conf/isqed/HwangLW12
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  - https://dblp.org/rec/conf/isqed/HwangLW12
Leslie Hwang, Kevin L. Lin, Martin D. F. Wong:
Thermal via structural design in three-dimensional integrated circuits. ISQED 2012: 103-108

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