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"Cooling architectures using thermal sidewalls, interchip plates, and ..."
Kaoru Furumi, Masashi Imai, Atsushi Kurokawa (2017)
- Kaoru Furumi, Masashi Imai, Atsushi Kurokawa:
Cooling architectures using thermal sidewalls, interchip plates, and bottom plate for 3D ICs. ISQED 2017: 283-288
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