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"Novel Methodology for Assessing Chip-Package Interaction Effects onChip ..."

Armen Kteyan et al. (2022)

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DOI: 10.1145/3505170.3511798

access: closed

type: Conference or Workshop Paper

metadata version: 2022-04-14

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  dblp key:
  - conf/ispd/KteyanCSBMZIGZV22
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  persistent URL:
  - https://dblp.org/rec/conf/ispd/KteyanCSBMZIGZV22
Armen Kteyan, Jun-Ho Choy, Valeriy Sukharev, Massimo Bertoletti, Carmelo Maiorca, Rossana Zadra, Massimo Inzaghi, Gabriele Gattere, Giancarlo Zinco, Paolo Valente, Roberto Bardelli, Alessandro Valerio, Pierluigi Rolandi, Mattia Monetti, Valentina Cuomo, Salvatore Santapa:
Novel Methodology for Assessing Chip-Package Interaction Effects onChip Performance. ISPD 2022: 83-89

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