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"Multi-project reticle floorplanning and wafer dicing."

Andrew B. Kahng et al. (2004)

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DOI: 10.1145/981066.981082

access: closed

type: Conference or Workshop Paper

metadata version: 2019-09-25

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  dblp key:
  - conf/ispd/KahngMWXZ04
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  - https://dblp.org/rec/conf/ispd/KahngMWXZ04
Andrew B. Kahng, Ion I. Mandoiu, Qinke Wang, Xu Xu, Alexander Zelikovsky:
Multi-project reticle floorplanning and wafer dicing. ISPD 2004: 70-77

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