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"Thermal Aware Design for Through-Silicon Via (TSV) based 3D ..."

Ujjwal Pasupulety, Bheemappa Halavar, Basavaraj Talawar (2018)

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DOI: 10.1109/ISED.2018.8704109

access: closed

type: Conference or Workshop Paper

metadata version: 2019-09-16

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Ujjwal Pasupulety, Bheemappa Halavar, Basavaraj Talawar:
Thermal Aware Design for Through-Silicon Via (TSV) based 3D Network-on-Chip (NoC) Architectures. ISED 2018: 236-240

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