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"Accuracy-improved coupling capacitance model for through-silicon via (TSV) ..."
Tarek Ramadan et al. (2016)
- Tarek Ramadan, Eslam Yahya, Mohamed Dessouky, Yehea Ismail:
Accuracy-improved coupling capacitance model for through-silicon via (TSV) arrays using dimensional analysis. ISCAS 2016: 1930-1933
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