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"On-chip integration of thermoelectric energy harvesting in 3D ICs."

Dawei Li, Seda Ogrenci Memik, Lawrence J. Henschen (2015)

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DOI: 10.1109/ISCAS.2015.7168824

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-26

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Dawei Li, Seda Ogrenci Memik, Lawrence J. Henschen:
On-chip integration of thermoelectric energy harvesting in 3D ICs. ISCAS 2015: 1078-1081

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