"Thermal Failure Simulation for Electrical Overstress in Semiconductor Devices."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Carlos H. Díaz, Charvaka Duvvury, Sung-Mo Kang (1993)

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DOI: —

access: unavailable

type: Conference or Workshop Paper

metadata version: 2016-05-20

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  dblp key:
  - conf/iscas/DiazDK93
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  persistent URL:
  - https://dblp.org/rec/conf/iscas/DiazDK93
Carlos H. Díaz, Charvaka Duvvury, Sung-Mo Kang:
Thermal Failure Simulation for Electrical Overstress in Semiconductor Devices. ISCAS 1993: 1389-1392

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