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"HCI Improvement on 14nm FinFET IO Device by Optimization of 3D Junction ..."

Xinggon Wan et al. (2019)

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DOI: 10.1109/IRPS.2019.8720526

access: closed

type: Conference or Workshop Paper

metadata version: 2019-05-31

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  dblp key:
  - conf/irps/WanZMWCG19
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  - https://dblp.org/rec/conf/irps/WanZMWCG19
Xinggon Wan, Baofu Zhu, Meera Mohan, Keija Wu, Dongil Choi, Arfa Gondal:
HCI Improvement on 14nm FinFET IO Device by Optimization of 3D Junction Profile. IRPS 2019: 1-4

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