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"Backside Failure Analysis of IGBT power devices assembled in STPAK."

Elisa Vitanza et al. (2023)

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DOI: 10.1109/IRPS48203.2023.10117973

access: closed

type: Conference or Workshop Paper

metadata version: 2023-05-24

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  dblp key:
  - conf/irps/VitanzaRMT23
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  - https://dblp.org/rec/conf/irps/VitanzaRMT23
Elisa Vitanza, C. Realmuto, M. La Marca, L. Torrisi:
Backside Failure Analysis of IGBT power devices assembled in STPAK. IRPS 2023: 1-4

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