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"Localized thermal effect of sub-16nm FinFET technologies and its impact on ..."

Yongsheng Sun et al. (2015)

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DOI: 10.1109/IRPS.2015.7112712

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Yongsheng Sun, Canhui Zhan, Jianping Guo, Yiwei Fu, Guangming Li, Jun Xia:
Localized thermal effect of sub-16nm FinFET technologies and its impact on circuit reliability designs and methodologies. IRPS 2015: 3

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