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"Wafer-level electromigration for reliability monitoring: Quick-turn ..."
D. Slottke et al. (2015)
- D. Slottke, R. J. Kamaladasa, M. Harmes, Ilan Tsameret, Mauro J. Kobrinsky, Timothy McMullen, John Dunklee:
Wafer-level electromigration for reliability monitoring: Quick-turn electromigration stress with correlation to package-level stress. IRPS 2015: 3
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