"A Comprehensive Wafer Level Reliability Study on 65nm Silicon Interposer."

C. S. Premachandran et al. (2019)

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DOI: 10.1109/IRPS.2019.8720515

access: closed

type: Conference or Workshop Paper

metadata version: 2019-05-31

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  - https://dblp.org/rec/conf/irps/PremachandranTB19
C. S. Premachandran, Thuy Tran-Quinn, Lloyd Burrell, Patrick Justison:
A Comprehensive Wafer Level Reliability Study on 65nm Silicon Interposer. IRPS 2019: 1-8

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