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"Silicon Reliability Characterization of Intel's Foveros 3D Integration ..."

Chetan Prasad et al. (2020)

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DOI: 10.1109/IRPS45951.2020.9129277

access: closed

type: Conference or Workshop Paper

metadata version: 2022-01-07

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  - conf/irps/PrasadCGHKLMNOP20
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  - https://dblp.org/rec/conf/irps/PrasadCGHKLMNOP20
Chetan Prasad, Sunny Chugh, Hannes Greve, I-chen Ho, Enamul Kabir, Cheyun Lin, Mahjabin Maksud, Steven R. Novak, Benjamin Orr, Keun Woo Park, Anthony Schmitz, Zhizheng Zhang, Peng Bai, Doug B. Ingerly, Emre Armagan, Hsinwei Wu, Patrick N. Stover, Lance Hibbeler, Michael O'Day, Daniel Pantuso:
Silicon Reliability Characterization of Intel's Foveros 3D Integration Technology for Logic-on-Logic Die Stacking. IRPS 2020: 1-5

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