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"Contact resistance of solder bump with low cost photosensitive polyimide ..."

Jongwoo Park et al. (2015)

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DOI: 10.1109/IRPS.2015.7112790

access: closed

type: Conference or Workshop Paper

metadata version: 2024-03-04

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  - conf/irps/ParkHLSKKKKJHKR15
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  - https://dblp.org/rec/conf/irps/ParkHLSKKKKJHKR15
Jongwoo Park, Jungpyo Hong, Miji Lee, Dongyoon Sun, Kyung Kang, Taesung Kim, Seungwon Kim, Sujin Kwon, Changkyu Joo, Sangsu Ha, Wooyeon Kim, Jongsu Ryu, Sangwoo Pae:
Contact resistance of solder bump with low cost photosensitive polyimide for high performance SoC. IRPS 2015: 3

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