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"Backside Die-Edge and Underfill Fillet Cracks Induced by Additional ..."

Khai Nguyen, Ernie Opiniano, Randolph Mah (2020)

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DOI: 10.1109/IRPS45951.2020.9129218

access: closed

type: Conference or Workshop Paper

metadata version: 2020-07-30

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  dblp key:
  - conf/irps/NguyenOM20
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Khai Nguyen, Ernie Opiniano, Randolph Mah:
Backside Die-Edge and Underfill Fillet Cracks Induced by Additional Tensile Stress from Increasing Die-to-Package Ratio in Bare-Die FCBGA. IRPS 2020: 1-4

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