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"Progressive Degradation Without Physical Failure During Mounting Due to ..."

Hyeokjae Lee et al. (2022)

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DOI: 10.1109/IRPS48227.2022.9764410

access: closed

type: Conference or Workshop Paper

metadata version: 2022-05-09

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  dblp key:
  - conf/irps/LeeKSJYPKKCKPS22
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  - https://dblp.org/rec/conf/irps/LeeKSJYPKKCKPS22
Hyeokjae Lee, Sanggi Ko, Ho-Joon Suh, Gina Jeong, Jung-Han Yeo, Hye-Min Park, Hee-Kyeong Kim, Jong-Kwan Kim, Sung S. Chung, Youngboo Kim, Jisun Park, Hyungsoon Shin:
Progressive Degradation Without Physical Failure During Mounting Due to Soft Overstress in Compound HBT for RF, Mobile, and Automotive Applications. IRPS 2022: 10

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