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"Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA ..."
Moon Soo Lee et al. (2021)
- Moon Soo Lee, Inhak Baick, Min Kim, Seo Hyun Kwon, Myeong Soo Yeo, Hwasung Rhee, Euncheol Lee:
Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique. IRPS 2021: 1-6
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