"Characterization of Cu and SiCN Adhesion in BEOL Interconnections."

Chang-Fu Han et al. (2025)

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DOI: 10.1109/IRPS48204.2025.10982984

access: closed

type: Conference or Workshop Paper

metadata version: 2025-06-04

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Chang-Fu Han, Jia-Ming Yang, Chia-Hua Chang, Yu-Sheng Lin, Jyun-Lin Wu, Yao-Chun Chuang, Ryan Lu:
Characterization of Cu and SiCN Adhesion in BEOL Interconnections. IRPS 2025: 39

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