"Effect of metal line width on electromigration of BEOL Cu interconnects."

Seungman Choi et al. (2018)

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DOI: 10.1109/IRPS.2018.8353600

access: closed

type: Conference or Workshop Paper

metadata version: 2019-05-29

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  - https://dblp.org/rec/conf/irps/ChoiCCZFSYOZFJ18
Seungman Choi, Cathryn Christiansen, Linjun Cao, James Zhang, Ronald Filippi, Tian Shen, Kong Boon Yeap, Sean P. Ogden, Haojun Zhang, Bianzhu Fu, Patrick Justison:
Effect of metal line width on electromigration of BEOL Cu interconnects. IRPS 2018: 4

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