"Thermo-Mechanical Stress and Its Effect on the Fabrication and Reliability ..."

Chih Chen et al. (2025)

> Home

Details and statistics

DOI: 10.1109/IRPS48204.2025.10983063

access: closed

type: Conference or Workshop Paper

metadata version: 2025-06-04

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/irps/ChenYLLT25
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/irps/ChenYLLT25
Chih Chen, Shih-Chi Yang, You-Yi Lin, Huai-En Lin, Dinh-Phuc Tran:
Thermo-Mechanical Stress and Its Effect on the Fabrication and Reliability of Cu-SiO2 Hybrid Bonds for 3D IC Heterogeneous Integration (Invited). IRPS 2025: 1-7

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.