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"A Novel Approach for Assessing Impact of Temperature Hot-Spots on ..."

R. Aggarwal et al. (2022)

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DOI: 10.1109/IRPS48227.2022.9764409

access: closed

type: Conference or Workshop Paper

metadata version: 2023-08-31

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  dblp key:
  - conf/irps/AggarwalJPLKK22
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  - https://dblp.org/rec/conf/irps/AggarwalJPLKK22
R. Aggarwal, L. Jiang, S. Patra, N. Lajo, Enamul Kabir, R. Kasim:
A Novel Approach for Assessing Impact of Temperature Hot-Spots on Chip-Package Interaction Reliability. IRPS 2022: 4

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