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"A Novel Approach for Assessing Impact of Temperature Hot-Spots on ..."
R. Aggarwal et al. (2022)
- R. Aggarwal, L. Jiang, S. Patra, N. Lajo, Enamul Kabir, R. Kasim:
A Novel Approach for Assessing Impact of Temperature Hot-Spots on Chip-Package Interaction Reliability. IRPS 2022: 4
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