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"Use of Paraplanar Constraint for Parallel Inspection of Wafer Bump Heights."
Mei Dong et al. (2007)
- Mei Dong, Ronald Chung, Edmund Y. Lam, Kenneth S. M. Fung:
Use of Paraplanar Constraint for Parallel Inspection of Wafer Bump Heights. IPCV 2007: 157-163
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