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"Measurement of In-Package Pressure Using Bondwires."

Yuxi Zhang, Albert Leung, Behraad Bahreyni (2018)

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DOI: 10.1109/ICSENS.2018.8589509

access: closed

type: Conference or Workshop Paper

metadata version: 2022-12-19

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  dblp key:
  - conf/ieeesensors/ZhangLB18
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  - https://dblp.org/rec/conf/ieeesensors/ZhangLB18
Yuxi Zhang, Albert Leung, Behraad Bahreyni:
Measurement of In-Package Pressure Using Bondwires. IEEE SENSORS 2018: 1-4

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