Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"A Novel Packaging Stress Isolation Chip for MEMS Devices."

Bowen Xing et al. (2019)

> Home

Details and statistics

DOI: 10.1109/SENSORS43011.2019.8956845

access: closed

type: Conference or Workshop Paper

metadata version: 2023-12-12

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/ieeesensors/XingZWHLWZ19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ieeesensors/XingZWHLWZ19
Bowen Xing, Bin Zhou, Jin Wang, Bo Hou, Xiang Li, Qi Wei, Rong Zhang:
A Novel Packaging Stress Isolation Chip for MEMS Devices. IEEE SENSORS 2019: 1-3

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.