"Substrate Solder Crack Evaluation and Modelling of Power Module under ..."

Zhongxu Wang et al. (2021)

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DOI: 10.1109/IECON48115.2021.9589509

access: closed

type: Conference or Workshop Paper

metadata version: 2022-01-13

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Zhongxu Wang, Yangang Wang, Lee Coulbeck, Xiang Li, Wei Gong:
Substrate Solder Crack Evaluation and Modelling of Power Module under Passive Cycling. IECON 2021: 1-6

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