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"Prediction of Package Chip Quality Using Fail Bit Count Data of the Probe ..."

Jin Soo Park, Seoung Bum Kim (2015)

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DOI: 10.1007/978-3-319-19066-2_63

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-19

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  dblp key:
  - conf/ieaaie/ParkK15
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Jin Soo Park, Seoung Bum Kim:
Prediction of Package Chip Quality Using Fail Bit Count Data of the Probe Test. IEA/AIE 2015: 655-664

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