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"Measuring the fracture toughness of low-k thin films used in advanced ..."

Luchao Wu, Lei Wang, Jun Wang (2021)

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DOI: 10.1109/ICTA53157.2021.9661599

access: closed

type: Conference or Workshop Paper

metadata version: 2023-11-06

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Luchao Wu, Lei Wang, Jun Wang:
Measuring the fracture toughness of low-k thin films used in advanced packaging. ICTA 2021: 131-132

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