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"Thermal Fatigue Analysis of Microbumps in a 3D TSV Integration Device."

Yuqing Lu, Jun Wang (2022)

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DOI: 10.1109/ICTA56932.2022.9962974

access: closed

type: Conference or Workshop Paper

metadata version: 2023-11-16

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  dblp key:
  - conf/icta3/LuW22
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Yuqing Lu, Jun Wang:
Thermal Fatigue Analysis of Microbumps in a 3D TSV Integration Device. ICTA 2022: 196-197

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