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"Proceedings of the Second International Conference on Technical Debt, ..."

Paris Avgeriou, Klaus Schmid (2019)

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DOI: —

access: closed

type: Editorship

metadata version: 2020-02-21

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Paris Avgeriou, Klaus Schmid:
Proceedings of the Second International Conference on Technical Debt, TechDebt@ICSE 2019, Montreal, QC, Canada, May 26-27, 2019. IEEE / ACM 2019, ISBN 978-1-7281-3371-3 [contents]

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